AMD Phenom II X4 850 3.3 GHz Quad-Core CPU Porcessoe HDX850WFK42GM Socket AM3

Description

Tip:

1: THE CPU is used, it is not brand-new, the scratches on the used CPU are normal, if you mind, please do not buy;

2. The origin of CPU is China and Malaysia, the origin does not affect the use, the performance is the same.Delivery is random, if you mind, please do not buy;

3: This link contains only one used CPU, no cooler. 

AMD Phenom II X4 850 specifications

The specs can be used for short-term
listings on auction and classifieds sites General information

Type
CPU / Microprocessor
Market segment
Desktop
Family
AMD Phenom II X4 Model number  ? 

850
CPU part numbers
HDX850WFK42GM
 is an OEM/tray microprocessor
HDX850WFGMBOX

 is a boxed microprocessor with fan and heatsink
Stepping codes
CACDC AC CADIC AD NADIC AD
Frequency  ? 

3300 MHz
Bus speed  ? 

667 MHz Memory controller
One 2000 MHz 16-bit HyperTransport link 4 GT/s
Clock multiplier  ? 

16.5
Package
938-pin organic micro-PGA
Sockets
Socket AM2+
Socket AM3
Introduction date
2nd quarter 2011
Architecture / Microarchitecture

Microarchitecture
K10
Platform
Dragon
Processor core  ? 

Propus
Core stepping  ? 

BL-C3
CPUID
100F53
Manufacturing process
0.045 micron silicon-on-insulator SOI technology
Die size
258mm2
Data width
64 bit
The number of CPU cores
4
The number of threads
4
Floating Point Unit
Integrated
Level 1 cache size  ? 

4 x 64 KB 2-way set associative instruction caches
4 x 64 KB 2-way set associative data caches
Level 2 cache size  ? 

4 x 512 KB 16-way set associative exclusive caches
Level 3 cache size
None
Cache latency
3 L1 cache
Virtual memory
256 TB
Multiprocessing
Uniprocessor
Features
MMX instructions
Extensions to MMX
3DNow! technology
Extensions to 3DNow!
SSE / Streaming SIMD Extensions
SSE2 / Streaming SIMD Extensions 2
SSE3 / Streaming SIMD Extensions 3
SSE4a  ? 

AMD64 / AMD 64-bit technology  ? 

EVP / Enhanced Virus Protection  ? 

AMD-V / AMD Virtualization technology
Low power features
Cool'n'Quiet 3.0
CoolCore Technology  ? 

Dual Dynamic Power Management  ? 

Core C1 and C1E states
Package S0, S1, S3, S4 and S5 states
Integrated peripherals / components

Integrated graphics
None
Memory controller

The number of controllers: 1
Memory channels: 2
Channel width bits: 72
Supported memory: DDR2-1066, DDR3-1333
DIMMs per channel: up to 2
Maximum memory bandwidth GB/s: 21.3
Other peripherals
HyperTransport 3 technology
Electrical / Thermal parameters

Thermal Design Power  ? 

95 Watt